What is padpad cratering?
What is padpad cratering?
Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB).
Can the AE technique be used to investigate pad cratering?
In this study, the AE technique is used to systematically investigate pad cratering in a daisy chain 40 x 40 mm Flip-Chip BGA (FCBGA) package with lead-free SAC305 solder balls and 1 mm ball pitch. AE sensors have been attached to a four- point bend test vehicle to determine the onset of either pad cratering or brittle IMC failures.
What factors affect susceptibility to pad cratering?
Susceptibility to pad cratering can be impacted by several factors such as: PCB thickness, PCB laminate material properties, component size and stiffness, component location, and solder alloy selection among other factors.
What is a crater in PCB?
• This occurs when the resin crack (fracture) migrates through a copper trace or via. • This happens at assembly, in service or during handling. • When component is removed, PCB copper pad comes with it, leaving behind a “crater” in the PCB.
