What is fan-out panel level packaging?

What is fan-out panel level packaging?

Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Technological core of FOWLP is the formation of a reconfigured molded wafer combined with a thin film redistribution layer to yield an SMD-compatible package.

What is the purpose of a fan-out layer in an IC package?

Fan-out WLP was developed to relax that limitation. It provides a smaller package footprint along with improved thermal and electrical performance compared to conventional packages, and allows having higher number of contacts without increasing the die size.

What is wafer level semiconductor?

Wafer-level chip scale packaging (WL-CSP) is the smallest package currently available on the market and is produced by OSAT (Outsourced Semiconductor Assembly and Test) companies, such as Advanced Semiconductor Engineering (ASE). There are two kinds of wafer level packaging: Fan-in and Fan-Out.

What is a fan-out package?

What is Fan-Out Packaging? Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer.

What is reconstructed wafer?

Wafer reconstruction is a process of forming an integral handle-able wafer by filling the gaps between the dies after die-to-wafer assembly to allow for further processing on the landing wafer, e.g. thinning, redistribution layer deposition, and bumping.

What is wafer reconstitution?

Abstract: Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing.

What is flip chip packaging?

A chip packaging technique in which the active area of the chip is “flipped over” facing downward. The flip chip allows for a large number of interconnects with shorter distances than wire, which greatly reduces inductance.

What is WLP in Semiconductor?

Wafer-level packaging (WLP) is the technology of packaging the die while it is still on the wafer—protective layers and electrical connections are added to the substrate before dicing. Originally, wafers were diced into individual chips, then packaged.

What is interposer in semiconductor?

An interposer can be defined as a silicon chip that can be used as a bridge or a conduit that allows electrical signals to pass through it and onto another element. The job of an interposer is to either spread the signal to a wider pitch or take the connection to a different socket on the board.

What is fan in semiconductor?

Fan-Out WLP (FOWLP) technology is an enhancement of standard wafer-level packages (WLPs) developed to provide a solution for semiconductor devices requiring a higher integration level and a greater number of external contacts. In conventional WLP schemes I/O terminals are located over the chip surface area.

What is the difference between WLCSP and wafer level fan-out?

Unlike wafer level fan-out, WLCSP offers the most simplistic process flow while providing thin, small with eash of assembly while populating many System In Packages (SiP) or smartphone board assembly. WLCSP also offers BackSide Protection (BSP) while maintaining the same footprint as the die area.

What is wafer level packaging (WLP)?

Amkor offers a broad array of Wafer Level Packaging (WLP) capabilities and processes for packaging schemes from fan-out to chip scale to 3D to System-in-Package (SiP).

What is a fan-in WLP?

Thus, fan-in WLPs are a unique form of packages and have the distinction of being truly die-sized. input/output (I/O) count and smaller die sizes.

What is the difference between fan-out and embedded die packaging?

A popular packaging technique now is to build packages with a standard Fan-Out type RDL, but with dies embedded in materials such as organic laminate or silicon wafer instead of the mold compound. Please refer to “ Embedded die packaging ” for more details. Fan-Out is a wafer-level packaging (WLP) technology.