What is FOSB and Foup?
What is FOSB and Foup?
The wafer carrier box used in moving from a wafer manufacturer to a semiconductor manufacturer is called a Front Opening Shipping Box (FOSB), and a carrier box used in a semiconductor manufacturing process line is called a Front Opening Unified Pod (FOUP).
What is FOUP in semiconductor?
FOUP is an acronym for Front Opening Unified Pod or Front Opening Universal Pod. It is a specialised plastic enclosure designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement.
How many wafers can a Foup hold?
The Spectra FOUP holds 300 mm wafers safely and securely while they are transported and transferred 8 to 16 kilometers (5 to 10 miles) within the fab as they move through hundreds of sophisticated process steps.
How much does a FOUP weigh?
Specifications
Dimensions | Width | 416 mm (16.4″) |
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Depth | 333 mm (13.1″) | |
Height | 335 mm (13.2″) | |
Weight | Empty | 4.2 kg (9.26 lb) |
With wafers | 7.3 kg (16.09 lb) |
Who makes FOUPs?
300 mm Front Opening Unified Pods (FOUPs) | Entegris.
What is an EFEM?
An Equipment Front End Module (EFEM) is the mainstay of semiconductor automation, shuffling silicon wafers between ultra-clean storage carriers and a variety of processing, measurement and testing systems.
What is SMIF pod?
The purpose of SMIF pods is to isolate wafers from contamination by providing a miniature environment with controlled airflow, pressure and particle count. SMIF is typically used for wafers no larger than 200mm, the equivalent for 300mm wafers being the FOUP (Front Opening Unified Pod).
How wafers are fabricated?
The silicon wafers start out blank and pure. The circuits are built in layers in clean rooms. First, photoresist patterns are photo-masked in micrometer detail onto the wafers’ surface. The wafers are then exposed to short-wave ultraviolet light and the unexposed areas are thus etched away and cleaned.
How many dies on a wafer?
The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: dice, dies and die….External links.
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Other | Microsoft Academic |
How long does it take to fabricate a wafer?
Here’s why: manufacturing a finished semiconductor wafer, known as the cycle time, takes about 12 weeks on average but can take up to 14-20 weeks for advanced processes. To perfect the fabrication process of a chip to ramp-up production yields and volumes takes even much more time – around 24 weeks.
How many chips are in a 300 mm wafer?
For info, around 600 A13 chips fit on a 300mm wafer.
What is a 300mm fab?
Photo of the interior of a clean room of a 300mm fab run by TSMC. In the microelectronics industry, a semiconductor fabrication plant (commonly called a fab; sometimes foundry) is a factory where devices such as integrated circuits are manufactured. Fabs require many expensive devices to function.
How does the Porta FosB™ work?
The device has a tilting platform allowing for secure manual transfer and opening of the 300mm carriers. The Porta FOSB ™ is isolated by servo actuated enclosure providing safe access to the wafers and clean front-end mini-environments.
What is a front Opening Unified Pod (FOUP)?
FOUP is an acronym for Front Opening Unified Pod or Front Opening Universal Pod. [2] It is a specialised plastic enclosure designed to hold silicon wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement. [3]
What are the FosB requirements for IC manufacturing?
the FOSB are specified; no material requirements or microcontamination limits are given. This standard assumes that the FOSB is used in the last process in wafer manufacturing, in acceptance and inspection, and in transferring the wafers from a FOSB to a front opening unified pod (FOUP) or open cassette inside an IC manufacturing process.
What does FosB stand for?
The SB300 front opening shipping box (FOSB) is an innovative 300 mm shipper that offers the benefits of manual and front-opening interface mechanical standard (FIMS)-compatible automation handling.