What is a fan-out in technology?

What is a fan-out in technology?

Fan-Out is a wafer-level packaging (WLP) technology. It is essentially a true chip-scale packaging (CSP) technology since the resulting package is roughly the same size as the die itself.

What is TSMC InFO technology?

InFO is an innovative wafer level system integration technology platform, featuring high density RDL (Re-Distribution Layer) and TIV (Through InFO Via) for high-density interconnect and performance for various applications, such as mobile, high performance computing, etc..

What is wafer bump?

Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where “bumps” or “balls” made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips.

What is fan-out software engineering?

In software construction, the fan-out of a class or method is the number of other classes used by that class or the number of other methods called by that method. Additionally, fan-out has impact on the quality of a software.

What is fan-out and fan in?

Fan-in refers to the maximum number of input signals that feed the input equations of a logic cell. Fan-out refers to the maximum number of output signals that are fed by the output equations of a logic cell.

Is Flip Chip wafer level packaging?

The wafer level package (flip chip and UCSP) represents a unique packaging form factor that might not perform equally to a packaged product through traditional mechanical reliability tests. The package’s reliability is integrally linked to the user’s assembly methods, circuit-board material, and usage environment.

What is TSMC Online?

Welcome to TSMC Online Portal. We register doctors to practise medicine in the state of Telangana. Our purpose is to protect, promote and maintain the health and safety of the public by ensuring proper standards in the practice of medicine.

What is InFO packaging?

What is under bump metallization?

Under bump metallization – or UBM – is an advanced packaging process that involves creating a thin film metal layer stack between the integrated circuit (IC) or copper pillars and solder bumps in a flip chip package.

What is UBM sputtering?

Under Bump Metallization (UBM) is required for connecting the die to the substrate with solder bumps for Flip-Chip packages. The UBM of the integrated circuit (IC) bonds pads that are typically aluminum but can be copper. This is an essential process step for the reliability of the electronic package.

What is the fan-out wafer-level package (FO-WLP)?

Figure 1. The Fan-Out Wafer-Level Package (FO-WLP) is an enhancement of standard WLPs, enabling a greater number of I/O connections. This package involves dicing chips from a silicon wafer, precisely positioning the known-good-die on a “reconstituted” or “carrier” wafer/ panel, which is then molded.

What is the difference between fan-out and embedded die packaging?

A popular packaging technique now is to build packages with a standard Fan-Out type RDL, but with dies embedded in materials such as organic laminate or silicon wafer instead of the mold compound. Please refer to “ Embedded die packaging ” for more details. Fan-Out is a wafer-level packaging (WLP) technology.

What is fan-out packaging?

Literally speaking, “Fan-Out” packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer.

What is silicon wafer integrated fan out technology (Swift™)?

To close this gap, Amkor has developed Silicon Wafer Integrated Fan-out Technology (SWIFT™) as an extension to the fan-out platform. SWIFT incorporates conventional WLFO processes with leading-edge thin-film patterning techniques to bridge the gap between TSV and traditional WLFO packages.