What is OSP finish in PCB?

What is OSP finish in PCB?

OSP stands for Organic Solderability Preservative. This is a type of PCB surface finish. Its main distinguishing characteristic is that it is water-based, therefore making it environmentally friendly. It is also lead-free and provides a low planar surface.

What is OSP finishing?

OSP (Organic Solderability Preservative) OSP is a water-based, organic surface finish that is typically used for copper pads. It selectively bonds to copper and protects the copper pad before soldering. OSP is environmentally friendly, provides a coplanar surface, is lead-free, and requires low equipment maintenance.

What is OSP made of?

The main materials of OSP PCB are rosin, active resin, azoles, and of course the bare boards. The process maintains the copper surface using oxidation. A conveyorized technique is used to apply a water-based organic compound on the surface. The rosin coating is applied as a flux treatment.

What is OSP process?

Outside Processing (OSP) is a subcontracting process where certain operations in a process routing are performed by the subcontractor. This process can be leveraged by manufacturers who do not always have the capabilities or equipment to perform all the steps in their manufacturing process to produce their products.

What is ENIG coating?

ENIG is a two layer metallic coating of 2-8 μin Au over 120-240 μin Ni. The Nickel is the barrier to the copper and is the surface to which the components are actually soldered to. ENIG is now arguably the most used finish in the PCB industry due the growth and implementation of the RoHs regulation.

What is PCB finish?

A PCB surface finish is an intermetallic joint between the bare copper of the solderable area of the printed circuit board and the components. Circuit boards have a base copper surface that is susceptible to oxidation if left without a protective coating, hence the requirement of the surface finish.

What is an OSP receipt?

Abbreviations: OSP – Outside Processing. PR – Purchase Requisition. PO – Purchase order. BPA – Blanket Purchase Agreement.

What is the difference between ENIG and HASL?

HASL is generally preferred for hand-soldering due to the easy joint formed. However, HASL leaves an uneven surface despite the leveling process. ENIG, on the other hand, provides for a very flat surface making ENIG preferable for fine pitch and high pin count components especially ball-grid array (BGA) devices.

Is ENIG same as immersion gold?

Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.

What is Enig coating?

What is OSP in PCB manufacturing?

OSP is a process for the surface treatment of printed circuit board (PCB) copper foil in accordance with the requirements of RoHS. OSP is the abbreviation of Organic Solderability Preservatives.

What is OSP coating?

OSP is a process for the surface treatment of printed circuit board (PCB) copper foil in accordance with the requirements of RoHS. OSP is the abbreviation of Organic Solderability Preservatives. It is also called “organic solder protection film”. It is also called “copper protecting agent”.

What is the reason for low solderability of OSP PCBs?

PCBs with OSP as surface finish are exposed to high temperature and humidity for such a long time that oxidation will be possibly generated on the surface of PCBs, thereafter leading to low solderability.

What are the disadvantages of OSP surface finish of printed circuit board?

If board with OSP surface finish is exposed to the open atmosphere and humidity, then there are chances that oxidation will possibly damage the surface of printed circuit board, and then it leads to further consequences ahead in the process of assembly and its functioning.