Why use a ball grid array BGA in a circuit?
Why use a ball grid array BGA in a circuit?
A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The traces connecting the package’s leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Can a BGA be Reballed?
Reballing is most often required when the alloy of the BGA component solder balls needs to be changed from lead-free to leaded. Every BGA Reballing project is completed to meet IPC and JEDEC specifications.
How do you solder a ball grid array?
BGA Soldering by Hand
- Apply Flux Paste (Not Liquid Flux) on to the pad.
- Place solder balls very carefully on the pad.
- Apply paste flux to the bottom (soldering side) of the BGA package.
- Carefully place the BGA Package on the solder balls.
- Preheat and then apply Hot Air with Hot Air Blower from both top and bottom.
What is the advantage of BGA?
BGA packages offer higher pin density, lower thermal resistance, and lower inductance than other types of packages. This means more interconnection pins and increased performance at high speeds as compared to dual in-line or flat packages. BGA is not without its disadvantages, though.
Why is IC reballing?
IC Reball is a kind of rework technique, which is used to repair faulty circuit board components such as ICs, resistors, capacitors etc. It also can be used to diagnose and repair PCBs. Reballing is mainly used for BGA and PGA chips with BGA balls cracked or missing that are unrepairable by other means.
Does BGA need solder paste?
In most cases BGA rework can be achieved, and is often more reliable, without addition of solder paste (i.e., using only the solder balls). This assumes a good site prep and proper flux process. In cases where there may be planarity issues, solder paste can be beneficial.
What is rework and repair?
Rework – The act of reprocessing non-complying product, through the use of original or alternate equivalent processing, in a manner that assures compliance of the product with applicable drawings or specifications. Repair – Action on a nonconforming product to make it conform to requirements.
Why do we need to repair and rework BGA?
One of the most common reasons for BGA repair and rework is the fact that the balls of tin solder, the “ball” in ball grid array, become unreliable due to the continuous heating and shrinking of the board or its components as caused by the normal heating cycle of the board.
Why choose ball grid array (BGA)?
One striking example of our commitment to state-of-the-art is our ability to rapidly rework and/or repair ball grid array (BGA). In today’s high-performance world of electronic circuitry, where there’s an ever-growing demand for greater levels of soldered circuitry per square unit of circuit board, BGA’s are an industry game-changer.
What are the BGA tolerances for the new push to produce?
In recent times, tolerances have usually been in the +/- 3 mil range, with the new push to produce 0.3 mm BGAs pushing things closer to the +/- 1 mil range. The tightened tolerances of these new specifications require additional equipment for validation and rework.
What is the best way to repair BGA pads?
BEST repair technicians use the epoxy method as a standard matter of course when it comes to the repair of BGA pads. Using this method, the greatest pull strength (in fact our studies indicate a comparable pull strength to the original attachment) is achieved.
