What is PCB potting?
What is PCB potting?
PCB potting is a method used to protect circuit boards (referred to in these contexts as the substrate) by filling the substrate’s enclosure with a liquid material called a potting compound or encapsulation resin. Potting provides excellent resistance to heat, chemicals, impacts and other common environmental hazards.
How does an encapsulation machine work?
During operation, the capsule delivery plate reciprocates up and down, and makes capsules enter holes and be stuck by the spring piece. Then the capsule delivery plate moves downward to make the spring piece releases the capsules, and then capsules falls.
What is the maximum possible amount of capsule filling?
Filling is possible through exchanging of parts. The SF-100N capsule filling machine is used for various industries like chemical, pharmaceutical, animal food and food. This machine can produce a maximum of 100,000 cap/hr. For pellet filling, the maximum capacity is 75,000 cap/hr.
How do you fill capsules with powder?
Put the top half of the capsule over the bottom and press down. Once you’ve got the bottom of the capsule filled, gently replace the top of the capsule. Hold the bottom of the capsule gently in one hand, then use the other to press the top of the capsule down. Store the capsules in a cool, dark place.
How do soft gel capsules work?
Soft-gel capsules Also known as liquid gels, they contain medication suspended in gelatin or a similar substance. This substance is easily digested, at which point active ingredients are released and absorbed.
How is potting done?
The potting process begins when the substrate is placed inside the pot. A liquid compound is then poured into the pot, filling it and covering the device completely. The liquid hardens, encasing the device inside it. The pot and the hardened compound surrounding the device become part of the final product.
What are the different methods of filling capsules?
The capsule filling machines can be classified into the following different types for use in pharmaceutical industries.
- Manual /Hand Operated Filling Machine.
- Semi-Automatic Capsule Filling Machine.
- Automatic Capsule Machine.
How do you fill capsules by hand?
What is potting and encapsulation?
Potting and Encapsulation. What is potting and electronic encapsulation? Potting and Encapsulation can be defined as the following: The process of encasing/protecting an electronic assembly within a container, typically using a thermosetting material which provides resistance to shock and vibration, or exclusion of moisture and corrosive agents.
What precautions should I take when potting and encapsulating components?
Care should be taken when potting and encapsulating to not damage the electronic components. One such precaution is choosing a potting compound that produces little heat during curing or is thermally conductive when working with heat-sensitive components.
Why is potting compound used to protect electronic components?
When the right potting compound is used, electronic components are properly protected over the long term; allowing for long-lasting reliable performance. In potting, a shell or a “pot”, containing a component, is filled with resin, which then becomes a part of the whole component.
When is a compound suitable for potting?
If the performance of the compound is unaffected after these cycling tests, the compound can be considered suitable and the potting process can be considered a success. In other words, it can withstand extreme conditions and adequately protect the components inside from damage. How Can Businesses Improve Their Potting and Encapsulation?
